Thermochemistry of liquid Ni―Sb―Sn alloysMISHRA, Ratikant; KROUPA, Ales; TERZIEFF, Peter et al.Thermochimica acta. 2012, Vol 536, pp 68-73, issn 0040-6031, 6 p.Article

SnZnAl lead-free solder with high packaging reliabilityKITAJIMA, Masayuki; SHONO, Tadaaki; MASUDA, Satoshi et al.SPIE proceedings series. 2003, pp 762-767, isbn 0-8194-5189-4, 6 p.Conference Paper

Enthalpy of mixing of liquid systems for lead free soldering: Ni―Sb―Sn systemELMAHFOUDI, A; FÜRTAUER, S; SABBAR, A et al.Thermochimica acta. 2012, Vol 534, pp 33-40, issn 0040-6031, 8 p.Article

Suppression of tin whisker formation on fine pitch connectors by surface rougheningTAKEUCHI, Makoto; KAMIYAMA, Kouichi; SUGANUMA, Katsuaki et al.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1918-1925, issn 0361-5235, 8 p.Conference Paper

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Lead-free soldering : An overview and comparison of the viable solutionsSEELIG, Karl; SURASKI, David.SPIE proceedings series. 2000, pp 558-563, isbn 0-930815-62-9Conference Paper

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

A case study of lead free thick film conductors with lead free solder alloysBOKALO, Peter; SHAHBAZI, Samson; SLIMS, Theresa D et al.SPIE proceedings series. 2003, pp 71-76, isbn 0-8194-5189-4, 6 p.Conference Paper

Thermodynamic properties of liquid Au―Bi―Sn alloysZHONGNAN GUO; WENXIA YUAN; HINDLER, Michael et al.Journal of chemical thermodynamics. 2012, Vol 48, pp 201-206, issn 0021-9614, 6 p.Article

The surface tension and density of the Cu-Ag-In alloysFIMA, Przemyslaw; WIATER, Katarzyna; KUCHARSKI, Marian et al.Surface science. 2007, Vol 601, Num 16, pp 3481-3487, issn 0039-6028, 7 p.Article

Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) systemHINDLER, Michael; GUOA, Zhongnan; MIKULA, Adolf et al.Journal of chemical thermodynamics. 2012, Vol 55, pp 102-109, issn 0021-9614, 8 p.Article

Evaluation of lead free soldering development by means of a holistic considerationTÜRPE, M.Advanced engineering materials (Print). 2006, Vol 8, Num 3, issn 1438-1656, 138, 161-164 [5 p.]Conference Paper

Enhancing overall mechanical performance of metallic materials using two-directional microwave assisted rapid sinteringGUPTA, M; WONG, W. L. E.Scripta materialia. 2005, Vol 52, Num 6, pp 479-483, issn 1359-6462, 5 p.Article

Enthalpies of mixing of liquid systems for lead free soldering: Al-Cu-Sn systemFLANDORFERA, Hans; RECHCHACH, Meryem; ELMAHFOUDI, A et al.Journal of chemical thermodynamics. 2011, Vol 43, Num 11, pp 1612-1622, issn 0021-9614, 11 p.Article

Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling ratesWEI, C; LIU, Y. C; HAN, Y. J et al.Journal of alloys and compounds. 2008, Vol 464, Num 1-2, pp 301-305, issn 0925-8388, 5 p.Article

Effects of addition participation in the interfacial reaction on the growth patterns of Cu₆Sn₅-based IMCs during reflow processGAO, F; TAKEMOTO, T.Journal of alloys and compounds. 2006, Vol 421, Num 1-2, pp 283-288, issn 0925-8388, 6 p.Article

Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic SoldersAKSÖZ, Namik; ÖZTÜRK, Esra; BAYRAM, Ümit et al.Journal of electronic materials. 2013, Vol 42, Num 12, pp 3573-3581, issn 0361-5235, 9 p.Article

Comparative thermodynamic study of Ga-In-Sb systemGOMIDZELOVIC, Lidija; ZIVKOVIC, Dragana; KOSTOV, Ana et al.Journal of thermal analysis and calorimetry. 2011, Vol 103, Num 3, pp 1105-1109, issn 1388-6150, 5 p.Article

Thermodynamic assessment of the Bi-Sn-Zn SystemVIZDAL, Jiri; BRAGA, Maria Helena; KROUPA, Ales et al.Calphad. 2007, Vol 31, Num 4, pp 438-448, issn 0364-5916, 11 p.Article

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle PasteYAMAKAWA, Tomohiro; TAKEMOTO, Tadashi; SHIMODA, Masayoshi et al.Journal of electronic materials. 2013, Vol 42, Num 6, pp 1260-1267, issn 0361-5235, 8 p.Article

Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during agingXI CHEN; ANMIN HU; MING LI et al.Journal of alloys and compounds. 2009, Vol 470, Num 1-2, pp 429-433, issn 0925-8388, 5 p.Article

Effects of aging treatment on mechanical properties and microstructure of Sn -8.5Zn -0.5Ag -0.01Al -0.1Ga SolderHSUAN, Teng-Chun; LIN, Kwang-Lung.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2007, Vol 456, Num 1-2, pp 202-209, issn 0921-5093, 8 p.Article

Kinetics of AuSn₄ migration in lead-free soldersCHANG, C. W; HO, C. E; YANG, S. C et al.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1948-1954, issn 0361-5235, 7 p.Conference Paper

Interfaces in lead-free solderingHWANG, Chi-Won; KIM, Keun-Soo; SUGANUMA, Katsuaki et al.Journal of electronic materials. 2003, Vol 32, Num 11, pp 1249-1256, issn 0361-5235, 8 p.Conference Paper

Phase stability of Ag-Sn alloy nanoparticlesKIJOO SIM; JOONHO LEE.Journal of alloys and compounds. 2014, Vol 590, pp 140-146, issn 0925-8388, 7 p.Article